Google's Next-Gen Tensor SoC Tapes Out Successfully at TSMC
According to recent reports, Google's next-generation Tensor System on Chip (SoC) has successfully taped out and is now ready for the next phase of development. The chip, which will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC) using their latest 3 nm process technology, is expected to significantly boost performance compared to its predecessor.
Google's In-House Design
The Tensor G5 SoC marks Google's first fully in-house design for a mobile processor. Previous generations of Tensor chips were based on Samsung Exynos SoCs. With the new design, Google aims to achieve comprehensive control from the processor to the operating system, applications, and devices.
Manufacturing with TSMC's 3 nm Process Technology
TSMC's advanced 3 nm process technology is expected to significantly enhance performance and power efficiency. The smaller chip size allows for more transistors to be integrated, increasing the chipset's capabilities for computing tasks.
Performance Improvements and Battery Optimization
The Tensor G5 chipset is anticipated to bring significant improvements in performance, battery optimisation, and AI capabilities. These enhancements will enable Google to offer a better user experience with its upcoming Pixel 10 series smartphones.
Sources: [1] Ctee.com - Google Tensor G5 SoC tapes out on TSMC's latest 3 nm node [2] Technode - Google's Tensor G5 processor to enter tape-out stage, manufactured with TSMC's 3nm process [3] Gadgets360 - Google Reportedly Completes Design Process for Its Tensor G5 Chipset