MediaTek's Dimensity 8300 Chipset Set to Power Premium 5G Smartphones

MediaTek's Dimensity 8300 is built on TSMC's 2nd generation 4nm process and uses the Armv9 architecture.
The chipset combines three cores 1+3+4, including a Cortex-X3 core with a speed of 2.8GHz, 3 Cortex-A715 cores with a speed of 2.4GHz, and 4 Cortex-A510 cores with a speed of 1.6GHz.
The Dimensity 8300 has been tested on Geekbench with Xiaomi's upcoming Redmi K70 smartphone, revealing impressive performance scores.
The Dimensity 8300 is expected to be used in various mid-range and premium phones to be released in 2024.

MediaTek, a leading semiconductor company, has announced the launch of its latest mobile chipset, the Dimensity 8300. The new chipset is designed for premium 5G smartphones and is expected to redefine user experiences with its advanced features and improved performance.

The Dimensity 8300 is built on TSMC's 2nd generation 4nm process, which promises 20% better performance and 30% peak gains in power efficiency compared to its predecessor. The processor uses the Armv9 architecture and consists of a high-performance Cortex-A715 core with a clock of 3.35GHz. The chipset combines three cores 1+3+4, including a Cortex-X3 core with a speed of 2.8GHz, 3 Cortex-A715 cores with a speed of 2.4GHz, and 4 Cortex-A510 cores with a speed of 1.6GHz.

The GPU relies on Mali G52 MC6 850MHz, which provides up to 60% greater performance and 55% better power efficiency. The chipset also combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity. It supports ultra-fast speeds with a built-in 3GPP Release-16 standard 5G modem.

The Dimensity 8300 has been tested on Geekbench with Xiaomi's upcoming Redmi K70 smartphone, revealing impressive performance scores. The device secured 1,512 single-core points and 4,886 multi-core points, showing a slight improvement over the previous Dimensity 8200 and 8200 Ultra. The Redmi K70 will also have 16GB of RAM and operate on Android 14 with Xiaomi's custom interface, HyperOS. A Pro model with the Snapdragon 8 Gen 3 chip is also expected.

The Dimensity 8300 is expected to be used in various mid-range and premium phones to be released in 2024. However, some sources suggest that new phones featuring the chipset may hit the global market before the end of 2023.

Confidence

95%

Doubts
  • There is a contradiction about the expected release date of phones featuring the Dimensity 8300 chipset.

Sources

90%

The overall score is a weighted number that takes into account conflict of interest, bias, deception and other practices that undermine the credibility of the source. It is calculated as:
(Site Conflicts Of Interest + Author Conflicts Of Interest) / 2.0 * 0.2 + ArticleBiasScore * 0.20 + UniquePointsScore * 0.05 + DeceptionScore * 0.20 + ReadabilityScore * 0.05 + FallacyScore * 0.20

A score that takes into consideration the content for flow, interruptions with ads, and overt search engine optimization techniques that makes the content hard to understand

MediaTek’s New Dimensity 8300 Chipset Redefines Premium Experiences…

MediaTek Tuesday, 21 November 2023 12:32
  • Unique Points
    None Found At Time Of Publication
  • Accuracy
    No Contradictions at Time Of Publication
  • Deception (100%)
    None Found At Time Of Publication
  • Fallacies (100%)
    None Found At Time Of Publication
  • Bias (100%)
    None Found At Time Of Publication
  • Site Conflicts Of Interest (80%)
    None Found At Time Of Publication
  • Author Conflicts Of Interest (100%)
    None Found At Time Of Publication

95%

The overall score is a weighted number that takes into account conflict of interest, bias, deception and other practices that undermine the credibility of the source. It is calculated as:
(Site Conflicts Of Interest + Author Conflicts Of Interest) / 2.0 * 0.2 + ArticleBiasScore * 0.20 + UniquePointsScore * 0.05 + DeceptionScore * 0.20 + ReadabilityScore * 0.05 + FallacyScore * 0.20

A score that takes into consideration the content for flow, interruptions with ads, and overt search engine optimization techniques that makes the content hard to understand

MediaTek's New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones

Taiwan News Taiwan News Tuesday, 21 November 2023 07:30
  • Unique Points
    • It supports ultra-fast speeds with a built-in 3GPP Release-16 standard 5G modem and includes several other key features.
  • Accuracy
    No Contradictions at Time Of Publication
  • Deception (100%)
    None Found At Time Of Publication
  • Fallacies (100%)
    None Found At Time Of Publication
  • Bias (100%)
    None Found At Time Of Publication
  • Site Conflicts Of Interest (100%)
    None Found At Time Of Publication
  • Author Conflicts Of Interest (100%)
    None Found At Time Of Publication

96%

The overall score is a weighted number that takes into account conflict of interest, bias, deception and other practices that undermine the credibility of the source. It is calculated as:
(Site Conflicts Of Interest + Author Conflicts Of Interest) / 2.0 * 0.2 + ArticleBiasScore * 0.20 + UniquePointsScore * 0.05 + DeceptionScore * 0.20 + ReadabilityScore * 0.05 + FallacyScore * 0.20

A score that takes into consideration the content for flow, interruptions with ads, and overt search engine optimization techniques that makes the content hard to understand

MediaTek announces Dimensity 8300 chip for premium 5G phones

htxt.co.za Robin-Leigh Chetty Tuesday, 21 November 2023 07:52
  • Unique Points
    • The processor features four Arm Cortex-A715 cores and four Cortex-A510 cores.
    • It also includes a Mali-G615 MC6 GPU upgrade, which provides up to 60% greater performance and 55% better power efficiency.
  • Accuracy
    No Contradictions at Time Of Publication
  • Deception (100%)
    None Found At Time Of Publication
  • Fallacies (100%)
    None Found At Time Of Publication
  • Bias (100%)
    None Found At Time Of Publication
  • Site Conflicts Of Interest (100%)
    None Found At Time Of Publication
  • Author Conflicts Of Interest (100%)
    None Found At Time Of Publication

98%

The overall score is a weighted number that takes into account conflict of interest, bias, deception and other practices that undermine the credibility of the source. It is calculated as:
(Site Conflicts Of Interest + Author Conflicts Of Interest) / 2.0 * 0.2 + ArticleBiasScore * 0.20 + UniquePointsScore * 0.05 + DeceptionScore * 0.20 + ReadabilityScore * 0.05 + FallacyScore * 0.20

A score that takes into consideration the content for flow, interruptions with ads, and overt search engine optimization techniques that makes the content hard to understand

Redmi K70 Geekbench Run Showcases MediaTek Dimensity 8300's Power – Pokde.Net

Pokde.Net Tuesday, 21 November 2023 03:00
  • Unique Points
    • Xiaomi's upcoming Redmi K70 smartphone, featuring MediaTek's Dimensity 8300 chip, has been tested on Geekbench, revealing impressive performance scores.
    • The device secured 1,512 single-core points and 4,886 multi-core points, showing a slight improvement over the previous Dimensity 8200 and 8200 Ultra.
    • The Redmi K70 will also have 16GB of RAM and operate on Android 14 with Xiaomi's custom interface, HyperOS.
    • A Pro model with the Snapdragon 8 Gen 3 chip is also expected.
  • Accuracy
    No Contradictions at Time Of Publication
  • Deception (100%)
    None Found At Time Of Publication
  • Fallacies (100%)
    None Found At Time Of Publication
  • Bias (100%)
    None Found At Time Of Publication
  • Site Conflicts Of Interest (100%)
    None Found At Time Of Publication
  • Author Conflicts Of Interest (100%)
    None Found At Time Of Publication

96%

The overall score is a weighted number that takes into account conflict of interest, bias, deception and other practices that undermine the credibility of the source. It is calculated as:
(Site Conflicts Of Interest + Author Conflicts Of Interest) / 2.0 * 0.2 + ArticleBiasScore * 0.20 + UniquePointsScore * 0.05 + DeceptionScore * 0.20 + ReadabilityScore * 0.05 + FallacyScore * 0.20

A score that takes into consideration the content for flow, interruptions with ads, and overt search engine optimization techniques that makes the content hard to understand

Begini Spesifikasi MediaTek Dimensity 8300

Selular.ID Monday, 20 November 2023 09:00
  • Unique Points
    • MediaTek is preparing to launch its latest mobile chipset, Dimensity 8300, on November 21, 2023.
    • The processor uses the Armv9 architecture and is built with a 4nm manufacturing process.
    • The Dimensity 8300 will consist of a high-performance Cortex-A715 core with a clock of 3.35GHz.
    • The chipset combines three cores 1+3+4, including a Cortex-X3 core with a speed of 2.8GHz, 3 Cortex-A715 cores with a speed of 2.4GHz, and 4 Cortex-A510 cores with a speed of 1.6GHz.
    • The GPU relies on Mali G52 MC6 850MHz.
    • The Dimensity 8300 is expected to be used in various mid-range and premium phones to be released in 2024.
  • Accuracy
    • The Dimensity 8300 is expected to be used in various mid-range and premium phones to be released in 2024. This contradicts other sources that state the chipset will power 5G devices launching in the global market before the end of 2023.
  • Deception (100%)
    None Found At Time Of Publication
  • Fallacies (100%)
    None Found At Time Of Publication
  • Bias (100%)
    None Found At Time Of Publication
  • Site Conflicts Of Interest (100%)
    None Found At Time Of Publication
  • Author Conflicts Of Interest (100%)
    None Found At Time Of Publication