Unknown Rajesh
Unknown Rajesh is a technology journalist who covers news and developments in the tech industry. Their work primarily focuses on mobile devices, chipsets, and foldable smartphones. They have reported on companies such as Xiaomi, Honor, Huawei, Nothing OS 3.0 feature launch date by Carl Pei himself
99%
The Daily's Verdict
This author is known for its high journalistic standards. The author strives to maintain neutrality and transparency in its reporting, and avoids conflicts of interest. The author has a reputation for accuracy and rarely gets contradicted on major discrepancies in its reporting.
Bias
98%
Examples:
- The articles provided show no clear signs of bias.
Conflicts of Interest
100%
Examples:
- There are no conflicts of interest detected in any of the articles provided.
Contradictions
98%
Examples:
- There are minor contradictions in the article about Huawei Mate 70 series, where it mentions the upcoming Kirin chip will have better performance than Snapdragon 8 Gen 2 and be mass produced on its 5nm node from SMIC. However, this contradicts previous reports that suggest Huawei may not have access to TSMC wafers due to the US trade ban, which could affect the quality of the chip.
Deceptions
100%
Examples:
- No deceptive practices were found in any of the articles.
Recent Articles
Samsung's Galaxy Tab S10 Series: A Game Changer with MediaTek Chips
Broke On: Thursday, 18 July 2024Samsung is set to launch its Galaxy Tab S10 series in October 2024 with MediaTek chips instead of Qualcomm's Snapdragon processors for cost savings. The Dimensity 9300B chip, a flagship offering from MediaTek, will power all models. This switch could lead to less expensive pricing and Samsung has previously used Exynos chips as a cost-cutting measure. The high-end Galaxy Tab S10 series is expected to launch in October 2024 with advanced features and no smaller base model. Google's Fuchsia OS Coming to Android Devices Through Virtualization: A Look into Microfuchsia and Its Potential Impact
Broke On: Sunday, 07 July 2024Google's Fuchsia OS, a microkernel-based operating system with improved efficiency, flexibility, and security through Zircon's microkernel architecture, is rumored to come to Android devices via virtualization. Using technology like QEMU and pKVM for isolation, Google aims to run Fuchsia on existing devices without interference. Huawei's Upcoming Mate 70: Rumored Kirin Chipset Outperforms Snapdragon 8 Gen 2, New Image Sensor, and HarmonyOS NEXT Integration
Broke On: Sunday, 07 July 2024Huawei's upcoming Mate 70 flagship phone may outperform competitors with its new Kirin chipset, manufactured by SMIC using DUV machinery. The chip is rumored to deliver better overall performance and improved interface fluidity compared to Qualcomm's Snapdragon 8 Gen 2. The device is also expected to feature a domestically produced 50-megapixel camera sensor and the official version of HarmonyOS NEXT, along with native WeChat support. Nothing OS 3.0: Unveiling Three New Lock Screen Styles and Interactive Dot Animation
Broke On: Saturday, 15 June 2024Nothing OS 3.0, set to release in September 2024, promises lock screen customizations for Nothing Phone users. Founder Carl Pei showcased three options: Default, Clock Widget, and Expanded Widget Area. The update will be available for the Nothing Phone (1), Nothing Phone (2), and Community Edition. Nokia Lumia Skyline: A Mid-Range Powerhouse with Triple Camera Setup and 120Hz FHD OLED Display
Broke On: Sunday, 09 June 2024HMD Global introduces the mid-range Nokia Lumia Skyline with a triple-lens camera, FHD OLED 120Hz display, and Android 14. Key features include a 108MP main sensor, ultrawide lens, macro or depth sensor, and a 32MP selfie camera. The phone boasts dual speakers with OZO audio technology and PureView tech. Expected to launch in July for around €520. Samsung Advances Chip Packaging Technology to Boost Performance and Efficiency
Broke On: Monday, 13 November 2023Samsung is developing its own chip packaging solution, SAINT (Samsung Advanced Interconnection Technology), to compete with TSMC's CoWoS (Chip-on-Wafer-on-Substrate) technology. Samsung Electronics is considering the application of 3D chiplet technology to its Exynos mobile application processors (APs). Samsung is reportedly starting to use a new chip packaging technology, FOWLP (Fan-Out Wafer Level Packaging), which improves chip performance and reduces power consumption.