Hassan Mujtaba

Hassan Mujtaba is a tech journalist who covers the latest news and developments in the technology industry. His work can be found on wccftech.com, where he provides insightful articles about various tech companies and their products. Hassan's primary focus is on topics such as AI, chip manufacturing, and PC hardware.

Biography:  https://wccftech.com/author/hms/

99%

The overall score is a weighted number that takes into account conflict of interest, bias, deception and other practices that undermines the credibility of the source. It is calculated as:
Analysis.OverallConflictOfInterestScore * 0.3F + Analysis.OverallBiasScore * 0.3F + Analysis.DeceptivenessScore * 0.3F + Analysis.ReadabilityScore * 0.1F

A score that takes into consideration the content for flow, interruptions with ads, and overt search engine optimization techniques that makes the content hard to understand

The Daily's Verdict

This author is known for its high journalistic standards. The author strives to maintain neutrality and transparency in its reporting, and avoids conflicts of interest. The author has a reputation for accuracy and rarely gets contradicted on major discrepancies in its reporting.

Bias

98%

Examples:

  • The author's articles show no signs of bias.

Conflicts of Interest

100%

Examples:

  • There are no conflicts of interest identified in the articles.

Contradictions

98%

Examples:

  • In one article, the author mentioned that Intel Thunderbolt Share software comes with an intuitive user interface for easy sharing and syncing. However, this is not a contradiction but rather a feature of the software.

Deceptions

100%

Examples:

  • The author's articles show no signs of deceptiveness.

Recent Articles

Qualcomm's New Snapdragon X CPUs Usher in the Microsoft Copilot AI PC Era: First Look at Features and Performance

Qualcomm's New Snapdragon X CPUs Usher in the Microsoft Copilot AI PC Era: First Look at Features and Performance

Broke On: Tuesday, 18 June 2024 Qualcomm's new Snapdragon X CPUs mark the start of the Microsoft Copilot AI PC era, offering out-of-the-box support for AI features like Auto SR technology. The first fully compliant platform leads in AI performance and includes up to 12 cores, LPDDR5x memory, and starts at $999 US.
AMD's Computex 2024 Keynote: Zen 5, RDNA 3.5, XDNA 2 NPU Cores and More

AMD's Computex 2024 Keynote: Zen 5, RDNA 3.5, XDNA 2 NPU Cores and More

Broke On: Monday, 03 June 2024 AMD showcases Zen 5, RDNA 3.5, and XDNA 2 cores at Computex 2024, with Dr. Lisa Su's keynote revealing updates on Ryzen 9000 Desktops and Strix lineup. Asus ROG Ally X addresses battery life and overheating issues in gaming handhelds, while AI hardware like GPT-4 glasses are expected. Computex 2024 focuses on high-performance computing, AI solutions, Windows gaming handhelds' sophomore year, and the beginning of the AI era.
Intel's Thunderbolt Share: A Game Changer for PC Users with Seamless Visual Experience, Increased Productivity, and Easy Collaboration

Intel's Thunderbolt Share: A Game Changer for PC Users with Seamless Visual Experience, Increased Productivity, and Easy Collaboration

Broke On: Wednesday, 15 May 2024 Intel's Thunderbolt Share: Seamlessly connect and collaborate between two PC systems using a single cable, with fast file transfers, smooth uncompressed screen-sharing, and easy folder synchronization. Available on select Thunderbolt 4 or 5 PCs running Windows in the second half of 2024.

Samsung Advances Chip Packaging Technology to Boost Performance and Efficiency

Broke On: Monday, 13 November 2023 Samsung is developing its own chip packaging solution, SAINT (Samsung Advanced Interconnection Technology), to compete with TSMC's CoWoS (Chip-on-Wafer-on-Substrate) technology. Samsung Electronics is considering the application of 3D chiplet technology to its Exynos mobile application processors (APs). Samsung is reportedly starting to use a new chip packaging technology, FOWLP (Fan-Out Wafer Level Packaging), which improves chip performance and reduces power consumption.